Despite everything, I couldn’t remove the crystal and ended up melting the circuit area in the attempt. So a fresh start. Before I do anything wrong again , could I just check that this is the correct orientation for pin 1 (highlighted)… so effectively I’d just flip this chip up and over onto the board… (I’m pretty sure this is how I lined them up before, so worried its still backwards)
this time I’m going to pre-solder all the pads, then just try and melt the crystal in one corner at a time rather than apply solder to the corners direct…
EDIT: to clarify, I did try and check the datasheet on mouser, but couldn’t confirm that bevelled pad was pin 1, just the chip’s dimensions.