I’d agree with most of the above. Personally I think 0603 is pretty much the same as 0805 in terms of difficulty – I went from TH straight to 0603 and find the SMT process less fiddly than through-hole overall.
Agreed that you don’t want to start with anything smaller than a SOIC IC. The pins on those chips are pitched at half the size of a through-hole DIP chip, so shouldn’t be too terrifying. A proper PCB with good soldermask (basically every board available these days) actually makes it pretty difficult to mess up the chips. When you do end up with too much solder & a bridge, solder-wick is the easiest way to remove some (not all) of the solder.
Buy a flux pen - it is almost essential for SMT builds imo. You just draw a line across the row of pins you want to solder before putting the IC in place – the pins almost solder themselves. I’ve always used the standard hakko / weller iron tips and find them totally fine for SMT work (even tiny parts).
Definitely steer clear of the digital projects at first with pins smaller than 0.05" pitch. These are not that difficult, but require a different technique to work with. It’s a kind of combination of the other SMT approaches (something like: flux, tack-solder, lots-of-solder, wick, flux, touch-up). Hence 2nd or 3rd project, and you’ll want to buy an extra chip or two of the small ones.
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